USB4/3.1 Type-C 24-Pin SMT/DIP Hybrid Male Plug

A Complete Technical Guide

USB Type-C continues to evolve, and USB4/3.1 connectors now appear in compact consumer electronics, industrial systems,
and high-speed data devices. Among these, the USB4/3.1 24-pin SMT/DIP Hybrid Male Plug stands out for its reliability,
mid-mount structure, and optimized mechanical strength.

This article provides a full technical explanation of the connector’s structure, dimensions, PCB design notes, applications, and advantages.

1. Product Overview

This connector is a USB4/USB 3.1 Type-C 24-pin hybrid male plug, designed with:

Mid-mount structure for reduced profile and stronger PCB engagement
Offset = 0.95 mm optimized for PCB stack-up
Hybrid termination: Dual-row DIP + Single-row SMT
Compact housing dimensions: CH = 0.25 mm, H = 11.2 mm, L = 14.65 mm
Full-function 24-pin configuration supporting high-speed differential pairs and high current charging

It is widely used in smart devices, U-disk storage, mobile accessories, U-key/ security tokens, and compact embedded systems.

2. Mechanical Structure

2.1 Connector Dimensions

Length (L): 14.65 mm
Height (H): 11.2 mm
Contact Height (CH): 0.25 mm
Offset: 0.95 mm (plug seating offset for mid-mount placement)

2.2 Hybrid Pin Termination

DIP Pins (Dual Row): Provide mechanical strength and grounding stability
SMT Pins (Single Row): Enable high-speed signal routing and automated SMT assembly

This dual-termination method significantly improves durability and pull-force resistance.

2.3 Mid-Mount Configuration

The mid-mount style reduces product height and enables the connector to be integrated into ultra-thin housings such as:

Portable U-disk drives
Smart mobile accessories
IoT handheld devices

3. Electrical Characteristics

Typical performance includes:

Parameter	Specification
Voltage Rating	20 V Max (USB PD)
Current Rating	Up to 5 A (VBUS)
High-Speed Support	USB 3.1 Gen2 / USB4
Differential Impedance	85 ± 10 Ω
Contact Resistance	≤ 40 mΩ
Durability	10,000 mating cycles

4. PCB Layout & Design Guidelines

To ensure optimal performance:

4.1 High-Speed Routing

Maintain controlled impedance for differential pairs
Keep trace length matching within 5 mil
Avoid vias on SuperSpeed differential pairs

4.2 DIP + SMT Pad Design

Strengthen solder joints with DIP anchor pins
Use via-in-pad for SMT rows only when necessary
Ensure copper thickness for current paths meets USB PD requirements

4.3 Mechanical Clearance

Maintain connector keep-out area as per dimensional drawing
Ensure shell grounding pads are well-connected to chassis ground

5. Applications

The hybrid design makes this connector ideal for smart, compact, and ruggedized devices:

U-Disk / Flash Storage Devices
Mobile alcohol tester
Heat-it mosquito repellent / portable thermal devices
Mobile-connected smart gadgets
U-key / security dongles
Consumer electronics & wearable devices
Industrial handheld interfaces

6. Key Advantages

✔ Hybrid SMT + DIP Structure

High mechanical reliability plus SMT manufacturability.

✔ Mid-Mount Low-Profile Design

Perfect for compact and ultra-thin devices.

✔ USB4/3.1 High-Speed Compatibility

Supports up to 40Gbps USB4 signaling (depending on system design).

✔ Strong Shell Grounding

Dual-row DIP anchors ensure stable grounding and EM shielding.

✔ Enhanced Durability

Rated for 10,000+ mating cycles, ideal for frequent-use applications.

7. Summary

The USB4/3.1 Type-C 24-pin SMT/DIP Hybrid Male Plug is a highly reliable and compact connector solution for high-speed data, power delivery, and embedded consumer applications.

Its mid-mount design, hybrid termination, and full USB4/3.1 compatibility make it an excellent choice for modern smart devices and portable electronics.

USB4/USB 3.1 Type-C 24-Pin SMT/DIP Hybrid Male Plug, Mid-Mount, Offset 0.95 mm, CH=0.25mm, H=11.2 mm, L=14.65 mm

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Everything You Need to Know About the USB4/3.1 Type-C 24-Pin Mid-Mount Hybrid Male Plug